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This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version IRFU series is for through- hole mounting applications.
FR9024N Datasheet PDF – International Rectifier
Power dissipation levels up to 1. The D-Pak is designed for surface mounting using. The straight lead version IRFU series is for through.
Soldering Temperature, for 10 seconds. Q g Total Gate Charge.
Q gs Gate-to-Source Charge. DataS Q he gd et4U. L D Internal Drain Inductance.
L S Internal Source Inductance. C iss Input Capacitance. C oss Output Capacitance. C rss Reverse Transfer Capacitance.
Tfpapzp Datasheet Unique Electronics Irc Archive for 02 03 – friv2hub
Source-Drain Ratings and Characteristics. I S Continuous Source Current.
Q rr Reverse Recovery Charge. For recommended footprint and soldering techniques refer to application note AN International Rectifier Electronic Components Datasheet. View PDF for Mobile.