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IPC JEDEC J STD 033A PDF

IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.

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IPC/JEDEC J-STDB | In Compliance Magazine

Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. The next phase will be lead-free solder compliance for upc assembly.

In this stage, the higher stx temperatures required for lead-free solders may have a profound effect on the connector insulator housings. Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering.

Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings.

Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason.

Figures 1 and 2. The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow.

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This delamination is commonly referred to as a “blister. Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors.

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But the problems listed previously for connectors in these hot oven environments can also result in board rework. Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of ipd heating, and peak temperature of the reflow process. The higher the peak temperature, the lower the moisture content can be before blistering.

Lead-free solders result in higher peak temperatures, meaning more blistering. The key parameter in blistering of connector housings is jwdec control of moisture absorption in the molded parts. The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2.

They were subjected to two different storage conditions: Table 3 shows that, at the storage conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag would provide enough moisture protection to keep the connectors below the blister threshold level for 90 days.

Str in two different thicknesses 0.

CARD, HUMIDITY INDICATOR, 5% 10% 15% RH, J-STDA | Arbell Electronics Distributor

Effectiveness of desiccant on moisture absorption of packaged connectors. Approved options include clay and silica gel.

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For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units. If all syd absorption precautions are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required. The company compared three moisture measurement jede All techniques provided similar moisture percentages in parts.

For ease of use, the halogen moisture analyzer was considered the best. The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature.

Higher temperatures required for lead-free SMT soldering shd force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.

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